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MCP73213T-A6BI/MF - Microchip

Description: Battery Management OVP BATTERY CHARGER DUAL CELL

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MCP73213T-A6BI/MF - Microchip - PCB symbol
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MCP73213T-A6BI/MF - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - (MF)10-Lead(DFN)
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MCP73213T-A6BI/MF - Microchip - 3D model - Small Outline No-lead - (MF)10-Lead(DFN)
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MCP73213T-A6BI/MF Details

  • Manufacturer Part Number:

    MCP73213T-A6BI/MF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DFN-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    DFN-10

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    21 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LINEAR BATTERY CHARGER

  • JESD-30 Code:

    S-PDSO-N10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC10,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    1.5 mA

  • Supply Voltage-Max (Vsup):

    16 V

  • Supply Voltage-Min (Vsup):

    4 V

  • Supply Voltage-Nom (Vsup):

    9.2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3 mm

MCP73213T-A6BI/MF Frequently Asked Questions (FAQs)

  • Microchip recommends following a 4-layer PCB stack-up with a solid ground plane, and using a star-connection for the power and ground pins. Additionally, keep the analog and digital traces separate, and use a common mode filter to reduce noise.
  • To optimize the performance of the internal voltage reference, ensure that the VREF pin is decoupled with a 10nF capacitor, and the AVDD pin is decoupled with a 1uF capacitor. Also, keep the VREF pin away from noisy digital signals.
  • The recommended calibration procedure involves applying a known input voltage to the ADC, and then adjusting the internal offset and gain registers to achieve the desired accuracy. Refer to the datasheet for the specific calibration procedure.
  • The POR and BOR circuits in the MCP73213T-A6BI/MF are designed to reset the device during power-up and brown-out conditions. Ensure that the power supply is stable and within the recommended operating range to prevent false resets.
  • The maximum allowed capacitance on the AVDD and AVSS pins is 10uF. Exceeding this value may affect the device's performance and stability.

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MCP73213T-A6BI/MF Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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