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MCP73213T-A6SI/MF - Microchip

Description: Battery Management Dual cell OVP battery charger

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MCP73213T-A6SI/MF - Microchip - PCB symbol
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MCP73213T-A6SI/MF - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - MCP73213T-A6SI/MF
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MCP73213T-A6SI/MF - Microchip - 3D model - Small Outline No-lead - MCP73213T-A6SI/MF
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MCP73213T-A6SI/MF Details

  • Manufacturer Part Number:

    MCP73213T-A6SI/MF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    3 X 3 MM, 0.90 MM HEIGHT, PLASTIC, DFN-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    DFN-10

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INPUT FAULT PROTECTION CONTROLLER

  • JESD-30 Code:

    S-PDSO-N10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC10,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    1.5 mA

  • Supply Voltage-Max (Vsup):

    16 V

  • Supply Voltage-Min (Vsup):

    4 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    3 mm

MCP73213T-A6SI/MF Frequently Asked Questions (FAQs)

  • Microchip recommends following a 4-layer PCB stack-up with a solid ground plane, and using a star-configuration for the power and ground connections. Additionally, keep the analog and digital traces separate and avoid crossing them over each other.
  • To ensure accuracy, use a high-quality external capacitor (e.g., 1uF ceramic) connected between the VREF pin and GND. Also, keep the VREF pin away from noise sources and ensure a low-impedance connection to the capacitor.
  • Power up the device in the following sequence: VDD, VCC, and then VIN. Ensure that VDD and VCC are powered up simultaneously, and VIN is powered up last. Also, ensure that the input voltage (VIN) is within the recommended operating range.
  • Use a thermal pad or a heat sink to dissipate heat. Ensure good airflow around the device, and consider using a thermal interface material (TIM) to improve heat transfer. Also, follow the recommended PCB layout and thermal design guidelines from Microchip.
  • Use a shielded enclosure, and ensure good grounding and bonding of the PCB and enclosure. Use EMI filters or common-mode chokes on the input and output lines, and follow the recommended PCB layout and routing guidelines to minimize radiation and susceptibility.

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MCP73213T-A6SI/MF Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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