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MCP73213T-A6W/MF - Microchip

Description: Battery Management OVP BATTERY CHARGER DUAL CELL

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MCP73213T-A6W/MF - Microchip - PCB symbol
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PCB Footprints
MCP73213T-A6W/MF - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - (MF)10-Lead(DFN)
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MCP73213T-A6W/MF - Microchip - 3D model - Small Outline No-lead - (MF)10-Lead(DFN)
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MCP73213T-A6W/MF Details

  • Manufacturer Part Number:

    MCP73213T-A6W/MF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DFN-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    DFN-10

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    21 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LINEAR BATTERY CHARGER

  • JESD-30 Code:

    S-PDSO-N10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC10,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    1.5 mA

  • Supply Voltage-Max (Vsup):

    16 V

  • Supply Voltage-Min (Vsup):

    4 V

  • Supply Voltage-Nom (Vsup):

    9.2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3 mm

MCP73213T-A6W/MF Frequently Asked Questions (FAQs)

  • Microchip provides a recommended PCB layout in the device's datasheet and application notes. It's essential to follow these guidelines to minimize noise, ensure proper thermal dissipation, and optimize the device's performance. Additionally, consider using a 4-layer PCB with a solid ground plane and a separate power plane to reduce noise and EMI.
  • The selection of external components depends on the specific application and requirements. Microchip provides guidelines for component selection in the datasheet and application notes. Consider factors such as capacitor values, ESR, and tolerance, as well as resistor values and tolerance. It's also essential to ensure that the components are compatible with the device's operating frequency and voltage range.
  • The MCP73213T-A6W/MF has an operating temperature range of -40°C to +125°C. The device's performance may be affected by temperature, with parameters such as accuracy, linearity, and noise performance potentially degrading at extreme temperatures. Ensure that the device is operated within the recommended temperature range to maintain optimal performance.
  • The MCP73213T-A6W/MF has an internal overvoltage protection (OVP) circuit that protects the device from input voltages exceeding 6.5V. However, it's recommended to add external OVP circuitry to protect the device from higher voltage transients. A simple OVP circuit can be implemented using a voltage regulator, zener diode, and resistors.
  • The recommended power-up sequence for the MCP73213T-A6W/MF is to apply the power supply voltage (VDD) before applying the input voltage (VIN). This ensures that the internal voltage regulators and bias circuits are properly initialized before the device starts operating. A power-up sequence diagram is typically provided in the datasheet or application notes.

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MCP73213T-A6W/MF Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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