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MCP8025-115E/PT - Microchip

Description: Motor / Motion / Ignition Controllers & Drivers 3-Phase Brushless DC Mot Gate Drvr, LIN

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MCP8025-115E/PT - Microchip PCB footprint - Quad Flat Packages - Quad Flat Packages - 48-Lead Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [TQFP] With Exposed Pad-Square
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3D Models
MCP8025-115E/PT - Microchip  - 3D model - Quad Flat Packages - 48-Lead Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [TQFP] With Exposed Pad-Square
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MCP8025-115E/PT Details

  • Manufacturer Part Number:

    MCP8025-115E/PT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    TQFP-48

  • Pin Count:

    48

  • Manufacturer Package Code:

    TQFP-48

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    25 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    3

  • Analog IC - Other Type:

    3-PHASE BRUSHLESS DC MOTOR CONTROLLER

  • JESD-30 Code:

    S-PQFP-G48

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTFQFP

  • Package Equivalence Code:

    QFP48,.35SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

  • Screening Level:

    AEC-Q100;TS 16949

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max (Isup):

    0.3 mA

  • Supply Voltage-Max (Vsup):

    19 V

  • Supply Voltage-Min (Vsup):

    6 V

  • Supply Voltage-Nom (Vsup):

    13 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    7 mm

MCP8025-115E/PT Frequently Asked Questions (FAQs)

  • Microchip provides a recommended PCB layout in the MCP8025-115E/PT evaluation board user's guide, which includes thermal vias and a thermal pad to help dissipate heat. Following this layout can help ensure optimal thermal performance.
  • To ensure reliable operation at high temperatures, it's essential to follow proper thermal design and layout guidelines, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider using a heat sink or thermal management system if the device will be operating in extreme temperatures.
  • While the datasheet specifies a recommended operating voltage range of 4.5V to 5.5V, the absolute maximum rating for the VIN pin is 6.5V. However, it's essential to note that operating the device above the recommended voltage range may affect its performance and reliability.
  • Yes, the MCP8025-115E/PT can be used in battery-powered applications. However, it's crucial to consider the device's quiescent current (IQ) and shutdown current (ISHDN) to ensure that the battery life meets the application's requirements. Additionally, consider using power-saving modes and optimizing the system's power management to minimize power consumption.
  • To troubleshoot issues with the device's output voltage regulation, start by verifying the input voltage, output voltage, and load current. Check for any signs of overheating, and ensure that the device is properly soldered and mounted. Use an oscilloscope to monitor the output voltage and look for any signs of oscillation or noise. If the issue persists, consult the datasheet and application notes for guidance on troubleshooting and potential solutions.

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MCP8025-115E/PT Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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