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MCP8026-115E/MP - Microchip

Description: 3-Phase BLDC Motor Driver, 40-Pin QFN Microchip MCP8026-115E/MP, Brushless DC Motor Driver

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MCP8026-115E/MP - Microchip - PCB symbol
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PCB Footprints
MCP8026-115E/MP - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 40LeadPlastic(QFN)(MP)
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3D Models
MCP8026-115E/MP - Microchip - 3D model - Quad Flat No-Lead - 40LeadPlastic(QFN)(MP)
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MCP8026-115E/MP Details

  • Manufacturer Part Number:

    MCP8026-115E/MP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    QFN-40

  • Pin Count:

    40

  • Manufacturer Package Code:

    VQFN-40

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    0

  • Analog IC - Other Type:

    3-PHASE BRUSHLESS DC MOTOR CONTROLLER

  • JESD-30 Code:

    S-PQCC-N40

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Number of Functions:

    1

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC40,.2SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max (Vsup):

    28 V

  • Supply Voltage-Min (Vsup):

    6 V

  • Supply Voltage-Nom (Vsup):

    13 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Width:

    5 mm

MCP8026-115E/MP Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal resistance. Additionally, consider using thermal protection and overcurrent protection circuits to prevent damage from overheating or overcurrent conditions.
  • Operating the device at a lower input voltage may reduce the output current capability, while operating at a higher input voltage may increase the output current capability but also increase the power dissipation and reduce the device lifespan.
  • Use a systematic approach to troubleshoot issues, starting with checking the input voltage, output current, and thermal conditions. Use oscilloscopes and thermal imaging cameras to monitor the device's behavior and identify potential issues. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • The device is designed to meet CISPR 25 Class 5 emissions standards. To minimize EMI, use a shielded enclosure, keep the PCB layout compact, and use filtering components such as ferrite beads and capacitors to reduce noise. Ensure that the device is operated within the recommended frequency range and that the output is properly filtered.

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MCP8026-115E/MP Overview

Use the download button to access the MCP8026-115E/MP schematic symbol, PCB footprint, and 3D model.
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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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