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MCP809T-270I/TT - Microchip

Description: Voltage Supervisor 2.625V Act.Low SOT23

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PCB Footprints
MCP809T-270I/TT - Microchip PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - MCP809T-270I/TT
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3D Models
MCP809T-270I/TT - Microchip  - 3D model - SOT23 (3-Pin) - MCP809T-270I/TT
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MCP809T-270I/TT Details

  • Manufacturer Part Number:

    MCP809T-270I/TT

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Package Description:

    PLASTIC, SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT-23-3

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.92 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.12 mm

  • Supply Current-Max (Isup):

    0.06 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    2.55 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.96 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +2.625V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    1.3 mm

MCP809T-270I/TT Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and ensure that the PCB is designed to minimize thermal resistance.
  • To ensure proper power-up and configuration, follow the recommended power-up sequence: VCC, then VIN. Ensure that the input voltage (VIN) is within the recommended range (2.7V to 5.5V). Also, configure the device according to the datasheet, paying attention to the EN (enable) pin, and the voltage regulator output (VOUT) configuration.
  • To ensure EMI and EMC compliance, follow best practices for PCB layout, component placement, and shielding. Use a multi-layer PCB with a solid ground plane, and place the device near the power source. Use shielding or a metal can to enclose the device, and ensure that all high-frequency signals are properly filtered and decoupled.
  • To troubleshoot issues, start by verifying the input voltage (VIN) and output voltage (VOUT) using an oscilloscope or multimeter. Check for proper power-up sequencing, and ensure that the device is properly configured. Verify that the thermal design is adequate, and check for any signs of overheating. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • Operating the device outside the recommended temperature range (-40°C to 125°C) may affect its performance, reliability, and lifespan. The device may experience reduced efficiency, increased power consumption, or even failure. Ensure that the device is operated within the recommended temperature range to ensure optimal performance and reliability.

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MCP809T-270I/TT Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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