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MCP809T-300I/TT - Microchip

Description: uP supervisor IC,MCP809T-300I/TT 2.925V

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PCB Footprints
MCP809T-300I/TT - Microchip PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - MCP809T-300I/TT
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MCP809T-300I/TT - Microchip  - 3D model - SOT23 (3-Pin) - MCP809T-300I/TT
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MCP809T-300I/TT Details

  • Manufacturer Part Number:

    MCP809T-300I/TT

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Package Description:

    PLASTIC, SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT-23-3

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.92 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.12 mm

  • Supply Current-Max (Isup):

    0.06 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    2.85 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.96 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +2.925V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    1.3 mm

MCP809T-300I/TT Frequently Asked Questions (FAQs)

  • A good thermal design should include a solid ground plane, thermal vias under the device, and a heat sink if possible. The datasheet provides some guidelines, but a more detailed application note (AN792) from Microchip provides additional guidance.
  • To ensure reliable start-up and shutdown, it's essential to follow the recommended power-up and power-down sequences outlined in the datasheet. Additionally, decoupling capacitors should be placed close to the device, and the input voltage should be stable and within the recommended range.
  • Operating the device at high temperatures can reduce its lifespan and affect its performance. The datasheet provides thermal derating curves, and it's essential to consider these when designing the system. Additionally, thermal monitoring and shutdown mechanisms can be implemented to prevent damage.
  • To troubleshoot issues, start by verifying the power supply and input voltage. Check for any signs of overheating, and ensure that the device is properly soldered and connected. Use an oscilloscope to monitor the input and output voltages, and consult the datasheet and application notes for guidance on specific troubleshooting techniques.
  • Yes, the device can be sensitive to electromagnetic interference (EMI). To minimize EMI, use a solid ground plane, keep the device away from high-frequency sources, and use shielding if necessary. The datasheet provides some EMI/EMC guidelines, and additional information can be found in Microchip's application notes.

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MCP809T-300I/TT Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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