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MCP809T-315I/TT - Microchip

Description: IC, Supervisor, push pull, active low, MCP809T-315I/TT

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MCP809T-315I/TT - Microchip - PCB symbol
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PCB Footprints
MCP809T-315I/TT - Microchip PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - MCP809T-315I/TT
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MCP809T-315I/TT - Microchip - 3D model - SOT23 (3-Pin) - MCP809T-315I/TT
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MCP809T-315I/TT Details

  • Manufacturer Part Number:

    MCP809T-315I/TT

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Package Description:

    PLASTIC, SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT-23-3

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.92 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.12 mm

  • Supply Current-Max (Isup):

    0.06 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.96 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +3.075V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    1.3 mm

MCP809T-315I/TT Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. A 2-layer or 4-layer PCB with a solid ground plane can also help to reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, and to consider the device's thermal derating. Additionally, ensure that the device is operated within its specified temperature range and that the PCB is designed to minimize thermal resistance.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It's essential to ensure that the device operates within its specified temperature range to maintain reliability and performance.
  • To troubleshoot issues related to the internal voltage regulator, check the input voltage, output voltage, and current consumption. Verify that the input voltage is within the specified range, and that the output voltage is within the expected range. Also, check for any signs of overheating or excessive current consumption.
  • To ensure EMI and EMC compliance, follow proper PCB layout guidelines, use shielding and filtering as necessary, and ensure that the device is operated within its specified frequency range. Additionally, consider using EMI filters or common-mode chokes to reduce electromagnetic interference.

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MCP809T-315I/TT Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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Part Image MCP809T-315I/TTVAO Microchip Technology Inc

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