Part Image

MCP80P06Y-BP - MCC

Description: N-CHANNEL MOSFET,TO-220AB(H)

Download MCP80P06Y-BP Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
MCP80P06Y-BP - MCC PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AB(H)
click to zoom
3D Models
MCP80P06Y-BP - MCC  - 3D model - Transistor Outline, Vertical - TO-220AB(H)
click to zoom

MCP80P06Y-BP Details

  • Manufacturer Part Number:

    MCP80P06Y-BP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    5

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    80 A

  • Drain-source On Resistance-Max:

    0.01 Ω

MCP80P06Y-BP Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing a thermal pad on the bottom of the package, using a minimum of 2oz copper thickness, and ensuring good thermal conduction to the surrounding copper area.
  • To ensure reliable operation in high-temperature environments, it is recommended to follow the recommended operating temperature range, use a heat sink if necessary, and ensure good airflow around the device.
  • To prevent ESD damage, it is recommended to handle the device in an ESD-controlled environment, use ESD-protective packaging and handling materials, and ensure that all personnel handling the device are grounded.
  • The MCP80P06Y-BP is a commercial-grade device, but it can be used in high-reliability or automotive applications with proper qualification and testing. It is recommended to consult with the manufacturer and follow industry standards for reliability and qualification.
  • The recommended soldering conditions for the MCP80P06Y-BP involve using a soldering temperature of 260°C (max) for 10 seconds (max), and ensuring that the device is not exposed to excessive moisture or thermal stress during the soldering process.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

MCP80P06Y-BP Overview

Use the download button to access the MCP80P06Y-BP schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MCP80, or try a keyword search, such as Power Field-Effect Transistors

Parts related to MCP80P06Y-BP

Showing 0 results