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MCP810T-450I/TT - Microchip

Description: Voltage Supervisor 4.375V Act.High SOT23

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MCP810T-450I/TT - Microchip - PCB symbol
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PCB Footprints
MCP810T-450I/TT - Microchip PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - MCP810T-450I/TT
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MCP810T-450I/TT - Microchip - 3D model - SOT23 (3-Pin) - MCP810T-450I/TT
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MCP810T-450I/TT Details

  • Manufacturer Part Number:

    MCP810T-450I/TT

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Package Description:

    PLASTIC, SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT-23-3

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.92 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.12 mm

  • Supply Current-Max (Isup):

    0.06 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    4.25 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.96 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +4.475V

  • Width:

    1.3 mm

MCP810T-450I/TT Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the device can help to dissipate heat efficiently. It's also recommended to keep the thermal path short and direct to the heat sink or thermal pad.
  • Ensure that the device is operated within the recommended temperature range (–40°C to +125°C). Use a heat sink or thermal pad to dissipate heat, and consider using a thermal interface material to improve heat transfer. Also, ensure that the PCB is designed to minimize thermal resistance.
  • A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for input decoupling. The capacitor should be placed as close to the device as possible to minimize inductance and ensure optimal performance.
  • Use a shielded enclosure, keep the PCB layout compact, and minimize loop areas. Also, use a common-mode choke or ferrite bead on the input lines to reduce EMI. Ensure that the device is placed away from noise sources and antennas.
  • A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for output filtering. The capacitor should be placed as close to the device as possible to minimize inductance and ensure optimal performance.

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MCP810T-450I/TT Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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