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MCP87055T-U/LC - Microchip

Description: Microchip MCP87055T-U/LC N-channel MOSFET Transistor, 60 A, 25 V, 8-Pin DFN

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PCB Footprints
MCP87055T-U/LC - Microchip PCB footprint - Other - Other - MCP87055T-U/LC-3
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3D Models
MCP87055T-U/LC - Microchip  - 3D model - Other - MCP87055T-U/LC-3
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MCP87055T-U/LC Details

  • Manufacturer Part Number:

    MCP87055T-U/LC

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    DFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    PDFN-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    162 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    25 V

  • Drain Current-Max (ID):

    60 A

  • Drain-source On Resistance-Max:

    0.007 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    114 pF

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation Ambient-Max:

    1.8 W

  • Power Dissipation-Max (Abs):

    1.8 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

MCP87055T-U/LC Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 4-layer PCB with a solid ground plane and a thermal relief pattern can help to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, use a suitable thermal interface material, and consider using a heat sink or thermal pad. Additionally, ensure that the device is operated within its specified temperature range and that the junction temperature is kept below the maximum rating.
  • For EMI and EMC compliance, it's crucial to follow proper PCB layout and design guidelines, use shielding and filtering techniques, and ensure that the device is operated within its specified frequency range. Additionally, consider using a common-mode choke and a ferrite bead to reduce EMI emissions.
  • To troubleshoot issues with the device's output voltage regulation, start by verifying the input voltage, output voltage, and load current. Check for any signs of overheating, and ensure that the device is operated within its specified temperature range. Also, verify that the output capacitor is of sufficient value and that the output voltage is within the specified range.
  • Operating the device beyond its specified maximum ratings can lead to reduced reliability, decreased performance, and potentially even device failure. It's essential to ensure that the device is operated within its specified voltage, current, and temperature ranges to guarantee reliable operation and prevent damage to the device.

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MCP87055T-U/LC Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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