Part Image

MCQ03N06-TP - MCC

Description: Mosfet Array 60V 3A 1.7W Surface Mount 8-SOP

Download MCQ03N06-TP Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
MCQ03N06-TP - MCC PCB footprint - Small Outline Packages - Small Outline Packages - SOP-8_2024
click to zoom
3D Models
MCQ03N06-TP - MCC  - 3D model - Small Outline Packages - SOP-8_2024
click to zoom

MCQ03N06-TP Details

  • Manufacturer Part Number:

    MCQ03N06-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    5.4

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    3 A

  • Drain-source On Resistance-Max:

    0.125 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    19.5 pF

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.7 W

  • Pulsed Drain Current-Max (IDM):

    10 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Element Material:

    SILICON

MCQ03N06-TP Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the MCQ03N06-TP is a standard SOT-223 package with a minimum pad size of 1.5mm x 1.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • To ensure proper thermal management, it's recommended to provide a thermal pad on the PCB, use a heat sink if necessary, and ensure good airflow around the device. The maximum junction temperature (Tj) should not exceed 150°C.
  • The maximum allowed voltage on the gate pin (Vgs) of the MCQ03N06-TP is ±20V, but it's recommended to keep it within ±15V for reliable operation.
  • While the MCQ03N06-TP can be used in switching applications, it's not optimized for high-frequency switching. The device has a relatively high gate charge (Qg) and input capacitance (Ciss), which may limit its performance at high frequencies. It's recommended to evaluate the device's performance in your specific application.
  • The MCQ03N06-TP is not AEC-Q101 qualified, which means it's not specifically designed for automotive applications. However, it can still be used in automotive applications if the customer performs their own qualification and testing to ensure the device meets their specific requirements.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

MCQ03N06-TP Overview

Use the download button to access the MCQ03N06-TP schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MCQ03, or try a keyword search, such as Power Field-Effect Transistors

Parts related to MCQ03N06-TP

Showing 0 results