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MCQ15N10YA-TP - MCC

Description: Power MOSFETS

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PCB Footprints
MCQ15N10YA-TP - MCC PCB footprint - Small Outline Packages - Small Outline Packages - SOP-8(H=1.75mm)
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3D Models
MCQ15N10YA-TP - MCC  - 3D model - Small Outline Packages - SOP-8(H=1.75mm)
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MCQ15N10YA-TP Details

  • Manufacturer Part Number:

    MCQ15N10YA-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    15 A

  • Drain-source On Resistance-Max:

    0.0125 Ω

  • JESD-609 Code:

    e3

  • Peak Reflow Temperature (Cel):

    260

  • Terminal Finish:

    Matte Tin (Sn)

  • Time@Peak Reflow Temperature-Max (s):

    10

MCQ15N10YA-TP Frequently Asked Questions (FAQs)

  • The recommended land pattern for MCQ15N10YA-TP is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape.
  • While the datasheet specifies an operating temperature range of -55°C to 150°C, it's recommended to derate the component's power handling capability at high temperatures. Consult with the manufacturer or a thermal expert for specific guidance.
  • To ensure reliability in high-vibration environments, follow proper PCB design and assembly guidelines, such as using a secure mounting method, minimizing PCB flexure, and using underfill or potting compounds to reduce stress on the component.
  • The recommended soldering profile for MCQ15N10YA-TP is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. However, it's recommended to consult the manufacturer's specific guidelines or industry standards like IPC-J-STD-020.
  • While the component is designed to operate in a variety of environments, it's recommended to take precautions to prevent moisture ingress, such as using conformal coatings or hermetic sealing, especially in humid or moist environments.

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MCQ15N10YA-TP Overview

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