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MCQ18N03-TP - MCC

Description: Power MOSFETS

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MCQ18N03-TP - MCC - PCB symbol
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PCB Footprints
MCQ18N03-TP - MCC PCB footprint - Small Outline Packages - Small Outline Packages - SOP-8(H=1.75mm)
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3D Models
MCQ18N03-TP - MCC - 3D model - Small Outline Packages - SOP-8(H=1.75mm)
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MCQ18N03-TP Details

  • Manufacturer Part Number:

    MCQ18N03-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    5.3

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    18 A

  • Drain-source On Resistance-Max:

    0.01 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    252 pF

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    3 W

  • Pulsed Drain Current-Max (IDM):

    65 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

MCQ18N03-TP Frequently Asked Questions (FAQs)

  • The thermal resistance of the MCQ18N03-TP is typically around 2.5°C/W, but it can vary depending on the specific application and PCB design.
  • Yes, the MCQ18N03-TP is a high-reliability device that meets the requirements of AEC-Q101, making it suitable for use in automotive and other high-reliability applications.
  • To ensure proper soldering, follow the recommended soldering profile and use a solder with a melting point above 217°C. Also, make sure the PCB is designed with a sufficient thermal pad to dissipate heat.
  • The MCQ18N03-TP is a low-frequency device, and its maximum operating frequency is typically around 100 kHz. Operating at higher frequencies may affect its performance and reliability.
  • The MCQ18N03-TP is rated for operation up to 150°C, but its performance and reliability may be affected at higher temperatures. It's recommended to derate the device's power handling and ensure proper heat sinking in high-temperature applications.

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MCQ18N03-TP Overview

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