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MCQD12N03A-TP - MCC

Description: Mosfet Array 30V 12A 2.5W Surface Mount 8-SOP

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PCB Footprints
MCQD12N03A-TP - MCC PCB footprint - Small Outline Packages - Small Outline Packages - SOP-8(H=1.75mm)
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MCQD12N03A-TP - MCC  - 3D model - Small Outline Packages - SOP-8(H=1.75mm)
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MCQD12N03A-TP Details

  • Manufacturer Part Number:

    MCQD12N03A-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    5.4

  • Case Connection:

    DRAIN

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    12 A

  • Drain-source On Resistance-Max:

    0.015 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    121 pF

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2.5 W

  • Pulsed Drain Current-Max (IDM):

    50 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

MCQD12N03A-TP Frequently Asked Questions (FAQs)

  • The thermal resistance of the MCQD12N03A-TP is typically around 2.5°C/W (junction-to-ambient) and 1.5°C/W (junction-to-case). However, this value can vary depending on the specific application and cooling conditions.
  • Yes, the MCQD12N03A-TP is a high-reliability device that is suitable for use in demanding applications such as aerospace, defense, and medical devices. It is built with high-quality materials and undergoes rigorous testing to ensure its reliability.
  • To ensure proper soldering of the MCQD12N03A-TP, follow the recommended soldering profile and use a solder with a melting point of 220°C or higher. Also, make sure the PCB is clean and free of oxidation, and use a soldering iron with a temperature control to prevent overheating.
  • The maximum operating frequency of the MCQD12N03A-TP is typically around 100 kHz, but this can vary depending on the specific application and circuit design. It's recommended to consult with a qualified engineer or the manufacturer's application notes for more information.
  • The MCQD12N03A-TP is rated for operation up to 150°C, but its performance may degrade at higher temperatures. If you need to operate the device in a high-temperature environment, it's recommended to consult with the manufacturer or a qualified engineer to determine the best approach.

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MCQD12N03A-TP Overview

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