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MCR006YZPJ000 - ROHM Semiconductor

Description: Thick Film Chip Resistors (MCR Series) <Automotive *Corresponds to AEC-Q200> : Chip resistors are highly reliable due to metal-glaze resistive element. They are long-seller in the market for needs from consumer electronics to industrial/automotive. The packages are available from the ultra-compact size best matching mobile communication appliances and portable equipment.

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PCB Footprints
MCR006YZPJ000 - ROHM Semiconductor PCB footprint - Resistor Chip - Resistor Chip - MCR006
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3D Models
MCR006YZPJ000 - ROHM Semiconductor  - 3D model - Resistor Chip - MCR006
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MCR006YZPJ000 Details

  • Manufacturer Part Number:

    MCR006YZPJ000

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    0

  • Construction:

    Chip

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.23 mm

  • Package Length:

    0.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.3 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.05 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistor Type:

    JUMPER

  • Size Code:

    0201

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

MCR006YZPJ000 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a large copper area connected to the thermal pad, and to use thermal vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves, ensure good thermal design, and consider using a heat sink or thermal interface material. Additionally, consider using a thermistor or thermocouple to monitor the temperature.
  • The MCR006YZPJ000 has built-in ESD protection, but it's still essential to follow standard ESD handling precautions during assembly and testing, such as using an ESD wrist strap, ESD mat, and ESD-safe packaging.
  • Yes, the MCR006YZPJ000 is suitable for high-reliability and automotive applications. However, it's essential to follow the recommended operating conditions, and to consult with ROHM Semiconductor for specific requirements and certifications, such as AEC-Q100.
  • The recommended soldering conditions for the MCR006YZPJ000 are a peak temperature of 260°C, with a soldering time of 10 seconds or less. It's essential to follow the recommended soldering profile to prevent damage to the device.

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MCR006YZPJ000 Overview

Use the download button to access the MCR006YZPJ000 schematic symbol, PCB footprint, and 3D model.
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Part Image RCM0603J000AS Samsung Electro-Mechanics

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For a full list of alternate parts for MCR006YZPJ000, check out Findchips.com