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MCR01MZPJ103 - ROHM Semiconductor

Description: RES SMD 10K OHM 5% 1/16W 0402

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MCR01MZPJ103 - ROHM Semiconductor - PCB symbol
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PCB Footprints
MCR01MZPJ103 - ROHM Semiconductor PCB footprint - Resistor Chip - Resistor Chip - MCR01_1
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MCR01MZPJ103 - ROHM Semiconductor - 3D model - Resistor Chip - MCR01_1
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MCR01MZPJ103 Details

  • Manufacturer Part Number:

    MCR01MZPJ103

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    9

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.35 mm

  • Package Length:

    1 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.063 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IATF 16949

  • Resistance:

    10000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0402

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    200 ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    50 V

MCR01MZPJ103 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MCR01MZPJ103 is a rectangular pad with a size of 1.3mm x 0.8mm, with a solder mask opening of 0.8mm x 0.5mm. The pad should be centered on the component.
  • The MCR01MZPJ103 has a thermal resistance of 250°C/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink, and keep the ambient temperature below 125°C.
  • The recommended soldering temperature profile for the MCR01MZPJ103 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be completed within 3 minutes.
  • Yes, the MCR01MZPJ103 is suitable for high-frequency applications up to 100 MHz. However, the impedance and parasitic capacitance should be considered in the design.
  • To ensure reliability in a humid environment, apply a conformal coating to the MCR01MZPJ103, and ensure the PCB is designed with moisture-resistant materials and a robust cleaning process.

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MCR01MZPJ103 Overview

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MCR01MZPJ103 Alternates

Showing results

Image Part Number Model
Part Image RK73B1ETTD103J KOA Corporation

Fixed Resistor, Metal Glaze/thick Film, 0.063W, 10000ohm, 50V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 0402
Part Image RCA040210K0JNEC Vishay Intertechnologies

Fixed Resistor, Metal Glaze/thick Film, 0.063W, 10000ohm, 50V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 0402, CHIP
Part Image SG73P1ELBK103J KOA Speer Electronics Inc

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 10000ohm, 50V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 0402
Part Image RK73B1ETBC103J KOA Speer Electronics Inc

Fixed Resistor, Metal Glaze/thick Film, 0.063W, 10000ohm, 50V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 0402
Part Image RK73B1ELTB103J KOA Speer Electronics Inc

Fixed Resistor, Metal Glaze/thick Film, 0.063W, 10000ohm, 50V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 0402
For a full list of alternate parts for MCR01MZPJ103, check out Findchips.com