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MCR01MZPJ301 - ROHM Semiconductor

Description: 300Ω 0402 Thick Film Surface Mount Resistor ±5% 0.063W MCR01MZPJ301

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MCR01MZPJ301 - ROHM Semiconductor - PCB symbol
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MCR01MZPJ301 - ROHM Semiconductor PCB footprint - Resistor Chip - Resistor Chip - MCR01MZPJ301
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MCR01MZPJ301 Details

  • Manufacturer Part Number:

    MCR01MZPJ301

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    9

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.35 mm

  • Package Length:

    1 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.063 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IATF 16949

  • Resistance:

    300 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0402

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    200 ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    50 V

MCR01MZPJ301 Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • The device requires a stable input voltage (Vin) between 2.5V to 5.5V, and a decoupling capacitor (e.g., 10uF) should be placed close to the device to filter out noise.
  • The maximum power dissipation is 1.5W, and the device should be operated within the recommended operating conditions to prevent overheating.
  • The device is rated for operation up to 125°C, but the maximum junction temperature (Tj) should not exceed 150°C. Derating is required for high-temperature operation.
  • Handle the device by the body or use an ESD wrist strap to prevent static electricity damage. The device has built-in ESD protection, but additional precautions are recommended.

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MCR01MZPJ301 Overview

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MCR01MZPJ301 Alternates

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Image Part Number Model
Part Image SFR01MZPJ301 ROHM Semiconductor

Fixed Resistor, Metal Glaze/thick Film, 0.063W, 300ohm, 50V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 0402
Part Image MC0402P-301-JB201Q RCD Components Inc

Fixed Resistor, Metal Glaze/thick Film, 0.063W, 300ohm, 50V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 0402
Part Image MCR01ZZPJ301 ROHM Semiconductor

Fixed Resistor, Metal Glaze/thick Film, 0.063W, 300ohm, 50V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 0402
Part Image RK73B1ELTD301J KOA Corporation

Fixed Resistor, Metal Glaze/thick Film, 0.063W, 300ohm, 50V, 5% +/-Tol, 200ppm/Cel, 0402
Part Image RC0402JRG13300R YAGEO Corporation

Fixed Resistor, Metal Glaze/thick Film, 0.0625W, 300ohm, 50V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 0402
For a full list of alternate parts for MCR01MZPJ301, check out Findchips.com