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MCR03ERTF2201 - ROHM Semiconductor

Description: Resistor Chip

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MCR03ERTF2201 - ROHM Semiconductor PCB footprint - Resistor Chip - Resistor Chip - MCR03
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MCR03ERTF2201 - ROHM Semiconductor  - 3D model - Resistor Chip - MCR03
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MCR03ERTF2201 Details

  • Manufacturer Part Number:

    MCR03ERTF2201

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    0

  • Construction:

    Chip

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    TS 16949

  • Resistance:

    2200 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    50 V

MCR03ERTF2201 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MCR03ERTF2201 can be found in the ROHM Semiconductor's packaging specification document or in the IPC-7351 standard. It's essential to follow the recommended land pattern to ensure reliable soldering and to prevent thermal issues.
  • To handle thermal dissipation, ensure that the device is mounted on a PCB with a sufficient thermal dissipation path. Use thermal vias and a thermal pad to dissipate heat efficiently. Additionally, consider using a heat sink or a thermal interface material to improve heat dissipation.
  • The maximum operating temperature range for the MCR03ERTF2201 is -40°C to 125°C. However, it's essential to note that the device's performance and reliability may degrade if operated at the extreme ends of this range.
  • Yes, the MCR03ERTF2201 is suitable for high-frequency applications. However, it's essential to consider the device's parasitic inductance and capacitance, as well as the PCB layout, to minimize signal degradation and ensure reliable operation.
  • To ensure reliability in a humid environment, consider applying a conformal coating to the PCB, using a moisture-resistant packaging, and following the recommended storage and handling procedures. Additionally, ensure that the device is operated within its recommended operating conditions.

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MCR03ERTF2201 Overview

Use the download button to access the MCR03ERTF2201 schematic symbol, PCB footprint, and 3D model.
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Part Image RMS06FT222 TA-I Technology Co Ltd

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Part Image CQ03WGJ0222TEE Royal Electronic Factory (Thailand) Co Ltd

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Part Image FPS03FT-222 Prosperity Dielectrics Co Ltd

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Part Image MCR03PZPIFX2201 ROHM Semiconductor

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Part Image WR06X2201FT Walsin Technology Corporation

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For a full list of alternate parts for MCR03ERTF2201, check out Findchips.com