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MCR03ERTJ562 - ROHM Semiconductor

Description: Resistor Chip

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MCR03ERTJ562 - ROHM Semiconductor - PCB symbol
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MCR03ERTJ562 - ROHM Semiconductor PCB footprint - Resistor Chip - Resistor Chip - MCR03
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MCR03ERTJ562 - ROHM Semiconductor - 3D model - Resistor Chip - MCR03
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MCR03ERTJ562 Details

  • Manufacturer Part Number:

    MCR03ERTJ562

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    0

  • Construction:

    Chip

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    TS 16949

  • Resistance:

    5600 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    200 ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    50 V

MCR03ERTJ562 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for MCR03ERTJ562 is -40°C to 125°C, as specified in the datasheet. However, it's essential to note that the device's performance and reliability may degrade if operated outside this range for extended periods.
  • To ensure proper soldering and mounting, follow the recommended land pattern and soldering conditions specified in the datasheet. Additionally, use a solder with a melting point above 220°C to prevent damage to the device. It's also crucial to handle the device by the body and avoid touching the pins to prevent electrostatic discharge (ESD) damage.
  • The maximum allowable power dissipation for MCR03ERTJ562 is 250mW, as specified in the datasheet. Exceeding this limit can cause the device to overheat, leading to reduced performance, reliability issues, or even permanent damage.
  • While the MCR03ERTJ562 is designed to operate in a variety of environments, it's essential to take precautions when using it in high-humidity conditions. Ensure the device is properly sealed and conformally coated to prevent moisture ingress. Additionally, follow the recommended storage and handling procedures to prevent moisture-related damage.
  • To troubleshoot issues with the MCR03ERTJ562, start by consulting the datasheet and application notes. Check the device's pinout, voltage supply, and signal connections. Use oscilloscopes or logic analyzers to verify signal integrity and timing. If the issue persists, contact ROHM Semiconductor's technical support or a qualified engineer for further assistance.

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MCR03ERTJ562 Overview

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MCR03ERTJ562 Alternates

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Part Image NRC06J562TRF NIC Components Corp

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Part Image TSR3MJ562V Tateyama Kagaku Group

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Part Image RC0603JRG135K6L YAGEO Corporation

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Part Image HCHP0603L5601JW151 Vishay Intertechnologies

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 5600ohm, 50V, 5% +/-Tol, -200,200ppm/Cel, 0603,
Part Image RC0603JRG135K6 YAGEO Corporation

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 5600ohm, 50V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 0603
For a full list of alternate parts for MCR03ERTJ562, check out Findchips.com