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MCR03EZPFX2203 - ROHM Semiconductor

Description: ROHM MCR Series Thick Film Surface Mount Resistor 0603 Case 220kΩ ±1% 0.1W ±100ppm/°C

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MCR03EZPFX2203 - ROHM Semiconductor - PCB symbol
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MCR03EZPFX2203 - ROHM Semiconductor PCB footprint - Resistor Chip - Resistor Chip - MCR03
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MCR03EZPFX2203 - ROHM Semiconductor - 3D model - Resistor Chip - MCR03
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MCR03EZPFX2203 Details

  • Manufacturer Part Number:

    MCR03EZPFX2203

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    9

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IATF 16949

  • Resistance:

    220000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    50 V

MCR03EZPFX2203 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a large copper area connected to the thermal pad, and to use thermal vias to dissipate heat to the other side of the board. Additionally, keeping the component away from other heat sources and using a thermal interface material can help.
  • To ensure the stability of the output voltage, it's essential to follow the recommended capacitor values and types, and to place them as close to the IC as possible. Additionally, using a low-ESR capacitor for the output capacitor can help to reduce output voltage ripple.
  • Although the datasheet specifies a maximum input voltage of 36V, it's recommended to derate the input voltage to 30V or less to ensure reliable operation and to prevent damage to the device.
  • The power dissipation of the device can be calculated using the formula: Pd = (Vin - Vout) x Iout. Where Vin is the input voltage, Vout is the output voltage, and Iout is the output current.
  • A ceramic capacitor with a value of 1uF to 10uF is recommended for the input capacitor. The capacitor should be rated for the maximum input voltage and should be placed as close to the IC as possible.

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MCR03EZPFX2203 Overview

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MCR03EZPFX2203 Alternates

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Part Image RMCG0603FT220K SEI Stackpole Electronics Inc

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Part Image RMC1/16K2203FTP Kamaya Inc

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