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MCR03EZPFX2321 - ROHM Semiconductor

Description: Resistor Chip

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MCR03EZPFX2321 - ROHM Semiconductor - PCB symbol
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MCR03EZPFX2321 - ROHM Semiconductor PCB footprint - Resistor Chip - Resistor Chip - MCR03
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MCR03EZPFX2321 - ROHM Semiconductor - 3D model - Resistor Chip - MCR03
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MCR03EZPFX2321 Details

  • Manufacturer Part Number:

    MCR03EZPFX2321

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    9

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Resistance:

    2320 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    50 V

MCR03EZPFX2321 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the MCR03EZPFX2321 is -40°C to 125°C.
  • To ensure reliability, follow the recommended derating guidelines for power dissipation and junction temperature, and consider using a heat sink or thermal management system.
  • The maximum allowable power dissipation for the MCR03EZPFX2321 is 1.5W, but this value may vary depending on the operating conditions and PCB design.
  • Yes, the MCR03EZPFX2321 is designed to operate in humid environments, but it's essential to follow proper packaging and handling procedures to prevent moisture-related issues.
  • Follow the recommended soldering and rework procedures, including using a soldering iron with a temperature below 260°C, and avoiding excessive heat or mechanical stress.

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MCR03EZPFX2321 Overview

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MCR03EZPFX2321 Alternates

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Image Part Number Model
Part Image TSR3GTF2321V Tateyama Kagaku Group

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 2320ohm, 50V, 1% +/-Tol, -100,100ppm/Cel, 0603,
Part Image NMCR0603FJ2K32 SEI Stackpole Electronics Inc

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 2320ohm, 50V, 1% +/-Tol, 100ppm/Cel, 0603
Part Image FCF03FV-36B-W Prosperity Dielectrics Co Ltd

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 2320ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603
Part Image CR16-2321FF ASJ Holdings Limited

Fixed Resistor
Part Image AF0603FR-102K32L YAGEO Corporation

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 2320ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603, CHIP, HALOGEN FREE AND ROHS COMPLIANT
For a full list of alternate parts for MCR03EZPFX2321, check out Findchips.com