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MCR03EZPFX27R0 - ROHM Semiconductor

Description: Resistor Chip

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MCR03EZPFX27R0 - ROHM Semiconductor - PCB symbol
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MCR03EZPFX27R0 - ROHM Semiconductor PCB footprint - Resistor Chip - Resistor Chip - MCR03
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MCR03EZPFX27R0 - ROHM Semiconductor - 3D model - Resistor Chip - MCR03
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MCR03EZPFX27R0 Details

  • Manufacturer Part Number:

    MCR03EZPFX27R0

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    9

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IATF 16949

  • Resistance:

    27 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    50 V

MCR03EZPFX27R0 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MCR03EZPFX27R0 can be found in the ROHM Semiconductor's packaging specification document, which provides detailed information on the recommended pad layout and dimensions for optimal soldering and assembly.
  • The MCR03EZPFX27R0 has a thermal resistance of 125°C/W, and it is recommended to use a thermal pad or a heat sink to dissipate heat. The device can operate up to 125°C, but it is recommended to keep the junction temperature below 100°C for optimal performance and reliability.
  • The recommended soldering profile for the MCR03EZPFX27R0 is a peak temperature of 260°C, with a dwell time of 30-60 seconds above 220°C. It is recommended to follow the IPC-J-STD-020 standard for soldering electronic components.
  • The MCR03EZPFX27R0 is a surface-mount device and can be used in high-vibration environments, but it is recommended to follow the recommended mounting and soldering procedures to ensure reliable operation. Additionally, it is recommended to perform vibration testing to ensure the device meets the required specifications.
  • The MCR03EZPFX27R0 is a moisture-sensitive device, and it is recommended to follow the recommended storage and handling procedures to prevent moisture absorption. It is also recommended to use a moisture barrier or a conformal coating to protect the device from humidity.

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MCR03EZPFX27R0 Overview

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MCR03EZPFX27R0 Alternates

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Part Image PWR03FVEX0270 Viking Tech Corp

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 27ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603, CHIP
Part Image FPS03FT-27R0-MD Prosperity Dielectrics Co Ltd

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 27ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603
Part Image PWR03FWEX27R0 Viking Tech Corp

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 27ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603
Part Image CR0603AFX-27R0EAS Bourns Inc

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 27ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603, CHIP
Part Image NMCR0603FT27R0 SEI Stackpole Electronics Inc

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 27ohm, 50V, 1% +/-Tol, 100ppm/Cel, 0603
For a full list of alternate parts for MCR03EZPFX27R0, check out Findchips.com