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MCR03EZPFX3303 - ROHM Semiconductor

Description: Resistor Chip

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MCR03EZPFX3303 - ROHM Semiconductor - PCB symbol
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MCR03EZPFX3303 - ROHM Semiconductor PCB footprint - Resistor Chip - Resistor Chip - MCR03
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MCR03EZPFX3303 - ROHM Semiconductor - 3D model - Resistor Chip - MCR03
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MCR03EZPFX3303 Details

  • Manufacturer Part Number:

    MCR03EZPFX3303

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    9

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IATF 16949

  • Resistance:

    330000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    50 V

MCR03EZPFX3303 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MCR03EZPFX3303 can be found in the ROHM Semiconductor's packaging specification document or in the IPC-7351 standard. It's essential to follow the recommended land pattern to ensure reliable soldering and to prevent thermal issues.
  • To handle thermal dissipation, ensure that the device is mounted on a PCB with a sufficient thermal dissipation path. Use thermal vias, thermal pads, or a heat sink to dissipate heat. Also, consider the thermal resistance of the PCB material and the device's thermal impedance.
  • The maximum operating temperature range for the MCR03EZPFX3303 is -40°C to 125°C. However, it's essential to consider the derating curves and thermal management to ensure reliable operation within the specified temperature range.
  • Yes, the MCR03EZPFX3303 is designed to withstand vibrations. However, it's crucial to ensure that the PCB is properly secured, and the device is mounted using a reliable soldering process to prevent mechanical stress and vibration-induced failures.
  • To ensure reliability in a humid environment, apply a conformal coating to the PCB, and ensure that the device is properly sealed. Also, consider using a moisture-resistant packaging material and follow the recommended storage and handling procedures.

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MCR03EZPFX3303 Overview

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MCR03EZPFX3303 Alternates

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Part Image SFR03EZPF3303 ROHM Semiconductor

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 330000ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603
Part Image FPS03FW-3303-MD Prosperity Dielectrics Co Ltd

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 330000ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603
Part Image PWR03FVEX3303N Viking Tech Corp

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 330000ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603, CHIP
Part Image RC0603FRF07330KL YAGEO Corporation

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 330000ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603
Part Image RK73H1JGTPD3303F KOA Speer Electronics Inc

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 330000ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603
For a full list of alternate parts for MCR03EZPFX3303, check out Findchips.com