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MCR03EZPFX3321 - ROHM Semiconductor

Description: Resistor Chip

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MCR03EZPFX3321 - ROHM Semiconductor - PCB symbol
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MCR03EZPFX3321 - ROHM Semiconductor PCB footprint - Resistor Chip - Resistor Chip - MCR03
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MCR03EZPFX3321 - ROHM Semiconductor - 3D model - Resistor Chip - MCR03
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MCR03EZPFX3321 Details

  • Manufacturer Part Number:

    MCR03EZPFX3321

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    10

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    3320 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    50 V

MCR03EZPFX3321 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a large copper area on the bottom layer connected to the thermal pad, and to use thermal vias to dissipate heat. A 2-3 layer PCB with a solid ground plane is also recommended.
  • To ensure reliable operation at high temperatures, make sure to follow the recommended operating conditions, use a suitable heat sink, and ensure good airflow around the device. Also, consider using a thermal interface material to improve heat transfer between the device and heat sink.
  • The maximum allowable voltage on the input pins is the supply voltage (VCC) + 0.3V. Exceeding this voltage may cause damage to the device.
  • To handle ESD protection, use a suitable ESD protection device, such as a TVS diode, on the input lines. Also, ensure that the PCB design follows good ESD protection practices, such as using a ground plane and minimizing trace lengths.
  • The recommended storage condition for this device is to store it in a dry, cool place, away from direct sunlight and moisture. The storage temperature should be between -40°C to 125°C, and the humidity should be below 60%.

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MCR03EZPFX3321 Overview

Use the download button to access the MCR03EZPFX3321 schematic symbol, PCB footprint, and 3D model.
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MCR03EZPFX3321 Alternates

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Part Image FPS03FT-3321-MB Prosperity Dielectrics Co Ltd

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 3320ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603
Part Image RMSW16K3321FB Kamaya Inc

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 3320ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603, CHIP
Part Image RC0603FRF133K32 YAGEO Corporation

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 3320ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603
Part Image 0603WGF3321TBE Royal Electronic Factory (Thailand) Co Ltd

Fixed Resistor, Metal Glaze/thick Film, 0.0625W, 3320ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603
Part Image 0603SAF3321CBE Royal Electronic Factory (Thailand) Co Ltd

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 3320ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603
For a full list of alternate parts for MCR03EZPFX3321, check out Findchips.com