- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for MCR03EZPFX62R0
- Part Number MCR03EZPFX62R0
- Manufacturer ROHM Semiconductor
- Pin Count 2
- Part Category Resistor
- Package Category Resistor Chip
- Footprint Name Resistor Chip - MCR03
- Released Date Mar 7, 2023
- Last Modified Date Mar 7, 2023 10:54 AM UTC
- Pinout / Pin List Click Here (Member Only)
MCR03EZPFX62R0 Details
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Manufacturer Part Number:
MCR03EZPFX62R0
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Pbfree Code:
Yes
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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Reach Compliance Code:
Compliant
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Country Of Origin:
Philippines, Thailand
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ECCN Code:
EAR99
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HTS Code:
8533.21.00.30
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Manufacturer:
ROHM Semiconductor
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YTEOL:
9
MCR03EZPFX62R0 Frequently Asked Questions (FAQs)
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The recommended land pattern for the MCR03EZPFX62R0 can be found in the ROHM Semiconductor's packaging specification document or in the IPC-7351 standard. It's essential to follow the recommended land pattern to ensure reliable soldering and to prevent thermal and mechanical stress.
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To prevent damage, handle the MCR03EZPFX62R0 by the body, avoiding touching the leads or the chip. Use anti-static wrist straps, mats, or tables to prevent electrostatic discharge (ESD) damage. Store the components in their original packaging or in a shielded container to prevent moisture absorption.
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The maximum power dissipation of the MCR03EZPFX62R0 is 0.5W. However, the actual power dissipation depends on the operating conditions, such as the ambient temperature, PCB layout, and airflow. Ensure that the component is operated within the recommended temperature range and that the PCB is designed to dissipate heat efficiently.
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The MCR03EZPFX62R0 is rated for operation up to 125°C. However, the component's reliability and lifespan may be affected by prolonged exposure to high temperatures. Ensure that the component is operated within the recommended temperature range, and consider using a heat sink or thermal management system if the environment is expected to exceed 125°C.
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To ensure the MCR03EZPFX62R0 is soldered correctly, follow the recommended soldering profile, and use a solder with a melting point below 260°C. Apply a small amount of solder paste to the pads, and use a reflow oven or a soldering iron with a temperature-controlled tip. Avoid overheating the component, and ensure that the solder joints are clean and free of oxidation.
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MCR03EZPFX62R0 Overview
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