ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
To ensure reliable operation in high-temperature environments, it is recommended to derate the power dissipation according to the temperature derating curve provided in the datasheet. Additionally, ensure good thermal design and heat sinking to keep the junction temperature below the maximum rating.
ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a ramp-up rate of 3°C/s. It is also recommended to use a solder with a melting point of 217°C or higher.
To prevent damage, it is recommended to store the components in a dry, cool place, away from direct sunlight and moisture. During shipping, use anti-static packaging and avoid bending or flexing the leads.
To prevent ESD damage, it is recommended to handle the components in an ESD-controlled environment, use anti-static wrist straps and mats, and avoid touching the leads or pins. Ground the component to a common ground point during handling and assembly.
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