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MCR03EZPFX82R5 - ROHM Semiconductor

Description: Resistor Chip

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MCR03EZPFX82R5 - ROHM Semiconductor - PCB symbol
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MCR03EZPFX82R5 - ROHM Semiconductor PCB footprint - Resistor Chip - Resistor Chip - MCR03
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MCR03EZPFX82R5 Details

  • Manufacturer Part Number:

    MCR03EZPFX82R5

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    9

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Resistance:

    82.5 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    50 V

MCR03EZPFX82R5 Frequently Asked Questions (FAQs)

  • ROHM recommends a land pattern with a minimum pad size of 0.5mm x 0.5mm and a spacing of 0.3mm between pads. A detailed land pattern is available in the ROHM Semiconductor's packaging specification document.
  • To ensure reliable operation, it's essential to provide a thermal path from the chip to a heat sink or a thermal pad on the PCB. ROHM recommends a thermal resistance of ≤10°C/W for the MCR03EZPFX82R5. A thermal analysis should be performed to ensure the device operates within the specified temperature range.
  • ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a total process time of 120-180 seconds. The soldering profile should be optimized to prevent thermal shock and ensure reliable solder joints.
  • While the MCR03EZPFX82R5 is a robust device, it's essential to ensure the PCB and component mounting are designed to withstand the vibration environment. ROHM recommends following the JEDEC standard for vibration testing (JESD22-B103) and performing additional testing to ensure the device's reliability in the specific application.
  • To troubleshoot issues, start by verifying the device's pinout, voltage supply, and signal integrity. Check for any signs of physical damage, overheating, or electrical overstress. Use oscilloscopes and logic analyzers to debug the circuit and identify the root cause of the issue. ROHM also provides application notes and technical support to help with troubleshooting.

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MCR03EZPFX82R5 Overview

Use the download button to access the MCR03EZPFX82R5 schematic symbol, PCB footprint, and 3D model.
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MCR03EZPFX82R5 Alternates

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Part Image HFPS03FT-82R5-M Hitano Enterprise Corp

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Part Image FCF03FV-82R5 Prosperity Dielectrics Co Ltd

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Part Image AR0603FR-0782R5L YAGEO Corporation

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Part Image RK73H1JGTDB82R5F KOA Speer Electronics Inc

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 82.5ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603
Part Image AF0603FR-1082R5L YAGEO Corporation

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 82.5ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603, CHIP, HALOGEN FREE AND ROHS COMPLIANT
For a full list of alternate parts for MCR03EZPFX82R5, check out Findchips.com