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MCR03EZPJ182 - ROHM Semiconductor

Description: 1.8kΩ 0603 Thick Film Surface Mount Resistor ±5% 0.1W MCR03EZPJ182

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MCR03EZPJ182 - ROHM Semiconductor PCB footprint - Resistor Chip - Resistor Chip - MCR03
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MCR03EZPJ182 - ROHM Semiconductor  - 3D model - Resistor Chip - MCR03
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MCR03EZPJ182 Details

  • Manufacturer Part Number:

    MCR03EZPJ182

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    9

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IATF 16949

  • Resistance:

    1800 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    200 ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    50 V

MCR03EZPJ182 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MCR03EZPJ182 can be found in the ROHM Semiconductor's packaging specification document, which provides detailed information on the recommended pad layout and dimensions for optimal soldering and assembly.
  • The MCR03EZPJ182 has a thermal resistance of 125°C/W, and it is recommended to use a thermal pad or a heat sink to dissipate heat. A thermal interface material (TIM) can also be used to improve heat transfer between the chip and the heat sink.
  • The MCR03EZPJ182 has an operating temperature range of -40°C to 125°C, but it is recommended to operate the device within a temperature range of -20°C to 85°C for optimal performance and reliability.
  • To ensure the reliability of the MCR03EZPJ182 in high-humidity environments, it is recommended to use a moisture-resistant coating or conformal coating on the PCB, and to follow proper storage and handling procedures to prevent moisture absorption.
  • The MCR03EZPJ182 has an ESD rating of 2 kV human body model (HBM) and 150 V machine model (MM). It is recommended to follow proper ESD handling and storage procedures to prevent damage to the device.

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MCR03EZPJ182 Overview

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Part Image RK73B1JLTE182J KOA Speer Electronics Inc

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 1800ohm, 50V, 5% +/-Tol, 200ppm/Cel, 0603

Part Image RMC1/16-182JTH Kamaya Inc

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 1800ohm, 50V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 0603

Part Image RK73A1JLTDD182J KOA Speer Electronics Inc

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 1800ohm, 50V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 0603

Part Image RK73B1JGBC182J KOA Corporation

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 1800ohm, 50V, 5% +/-Tol, 200ppm/Cel, 0603

Part Image 0603SAJ0182TAE Royal Electronic Factory (Thailand) Co Ltd

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 1800ohm, 50V, 5% +/-Tol, -200,200ppm/Cel, 0603,

For a full list of alternate parts for MCR03EZPJ182, check out Findchips.com