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MCR50JZHF2001 - ROHM Semiconductor

Description: ROHM MCR Series Thick Film Surface Mount Resistor 2010 Case 2kΩ ±1% 0.5W ±100ppm/°C

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MCR50JZHF2001 Details

  • Manufacturer Part Number:

    MCR50JZHF2001

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    0

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    5 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    2.5 mm

  • Packing Method:

    TR, EMBOSSED, 7 INCH

  • Rated Power Dissipation (P):

    0.5 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IATF 16949

  • Resistance:

    2000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    2010

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

MCR50JZHF2001 Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the device is operated within the recommended temperature range (TJ = -40°C to 150°C). Use a heat sink or thermal interface material to reduce thermal resistance. Also, consider derating the power dissipation at high temperatures.
  • ROHM recommends a reflow soldering profile with a peak temperature of 260°C, and a dwell time of 30-60 seconds above 220°C. Hand soldering is not recommended due to the high power density of the device.
  • Yes, but ensure that the PCB is designed to withstand the vibration levels. ROHM recommends using a secure mounting method, such as screwing or adhesive, to prevent the device from detaching from the PCB.
  • Use a robust EOS protection scheme, including TVS diodes and resistors, to limit voltage transients. Ensure that the device is operated within the recommended voltage range, and avoid exceeding the maximum ratings.

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MCR50JZHF2001 Overview

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MCR50JZHF2001 Alternates

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Part Image CQ10W2F2001T2E Royal Electronic Factory (Thailand) Co Ltd

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Part Image 2010W2F2001T1 Royal Electronic Factory (Thailand) Co Ltd

Fixed Resistor, Metal Glaze/thick Film, 0.5W, 2000ohm, 200V, 1% +/-Tol, -100,100ppm/Cel, 2010,
Part Image 2010W2F2001B2E Royal Electronic Factory (Thailand) Co Ltd

Fixed Resistor, Metal Glaze/thick Film, 0.5W, 2000ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 2010
For a full list of alternate parts for MCR50JZHF2001, check out Findchips.com