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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for MCR716T4G
- Part Number MCR716T4G
- Manufacturer onsemi
- Pin Count 3
- Part Category Integrated Circuit
- Package Category Other
- Footprint Name Other - DPAK CASE 369C
- Released Date Dec 27, 2020
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
MCR716T4G Details
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Manufacturer Part Number:
MCR716T4G
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Brand Name:
ON Semiconductor
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Pbfree Code:
Yes
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Rohs Code:
Yes
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Part Life Cycle Code:
Transferred
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Part Package Code:
TO-252
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Package Description:
LEAD FREE, PLASTIC, CASE 369C-01, DPAK-3
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Pin Count:
3
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Manufacturer Package Code:
369C
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ECCN Code:
EAR99
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HTS Code:
8541.30.00.80
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Manufacturer:
onsemi
MCR716T4G Frequently Asked Questions (FAQs)
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A good PCB layout for optimal thermal performance involves placing thermal vias under the package, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the package and to avoid routing high-current traces under the device.
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To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, use a suitable thermal interface material, and consider derating the device's power dissipation according to the temperature rating. Additionally, ensure that the device is operated within its specified temperature range and that the junction temperature is kept below the maximum rating.
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The recommended soldering conditions for the MCR716T4G are: peak temperature of 260°C, soldering time of 10-30 seconds, and a soldering temperature profile that follows the JEDEC J-STD-020 standard. It's also recommended to use a solder with a melting point above 217°C and to avoid using solder with a high silver content.
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To handle ESD protection for the MCR716T4G, it's recommended to follow proper ESD handling procedures, such as using an ESD wrist strap or mat, and storing the devices in anti-static packaging. Additionally, consider adding ESD protection devices, such as TVS diodes or ESD arrays, to the PCB design to protect the device from electrostatic discharge.
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The MCR716T4G's power dissipation can have implications on the system design, such as requiring a heat sink or thermal management system, affecting the overall system power consumption, and influencing the selection of other components, such as voltage regulators and capacitors. It's essential to consider the device's power dissipation when designing the system's power budget and thermal management strategy.
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MCR716T4G Overview
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