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MCSH31B104K500CT - Multicomp Pro

Description: MULTICOMP - MCSH31B104K500CT - CAP, MLCC, X7R, 100NF, 50V, 1206

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MCSH31B104K500CT - Multicomp Pro PCB footprint - Capacitor Chip Non-polarised - Capacitor Chip Non-polarised - MCSH31 (thickness code B)
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MCSH31B104K500CT - Multicomp Pro  - 3D model - Capacitor Chip Non-polarised - MCSH31 (thickness code B)
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MCSH31B104K500CT Details

  • Manufacturer Part Number:

    MCSH31B104K500CT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Unknown

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.24.00.20

  • Manufacturer:

    SPC Multicomp

  • YTEOL:

    7.49

  • Capacitance:

    0.1 µF

  • Capacitor Type:

    CERAMIC CAPACITOR

  • Dielectric Material:

    CERAMIC

  • Height:

    1.25 mm

  • JESD-609 Code:

    e3

  • Length:

    3.2 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Multilayer:

    Yes

  • Negative Tolerance:

    10%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Packing Method:

    TR, PAPER/PLASTIC, 7 INCH

  • Positive Tolerance:

    10%

  • Rated (DC) Voltage (URdc):

    50 V

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Temperature Characteristics Code:

    X7R

  • Temperature Coefficient:

    15% ppm/°C

  • Terminal Finish:

    TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Width:

    1.6 mm

MCSH31B104K500CT Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MCSH31B104K500CT can be found in the IPC-7351 standard or by consulting with the manufacturer's application notes. A general guideline is to use a land pattern with a pad size of 2.5mm x 1.25mm and a spacing of 0.5mm between pads.
  • The MCSH31B104K500CT is a moisture-sensitive device. To handle it, follow the manufacturer's recommended storage and handling procedures, such as storing the components in a dry, nitrogen-filled environment, and baking the components before reflow soldering if they have been exposed to moisture.
  • The maximum reflow temperature for the MCSH31B104K500CT is 260°C, with a recommended reflow profile of 3°C/sec ramp-up, 30-second dwell time at 250°C, and 6°C/sec ramp-down.
  • The MCSH31B104K500CT is designed for general-purpose use and may not be suitable for high-vibration environments. If your application requires high vibration resistance, consider using a capacitor specifically designed for such environments, such as those with a more robust termination or specialized mounting options.
  • The ESR of the MCSH31B104K500CT can be determined by measuring the impedance of the capacitor at high frequencies (e.g., 100 kHz) using an impedance analyzer or a network analyzer. The ESR can also be estimated using the capacitor's datasheet values and the following formula: ESR = (ESL / (2 * π * f * C)), where ESL is the equivalent series inductance, f is the frequency, and C is the capacitance.

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MCSH31B104K500CT Overview

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For a full list of alternate parts for MCSH31B104K500CT, check out Findchips.com