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MCT06030C2700FP500 - Vishay

Description: Thin Film Resistors - SMD .1W 270ohms 1% 0603 50ppm Auto

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MCT06030C2700FP500 - Vishay - PCB symbol
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PCB Footprints
MCT06030C2700FP500 - Vishay PCB footprint - Resistor Chip - Resistor Chip - MCT0603
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MCT06030C2700FP500 - Vishay - 3D model - Resistor Chip - MCT0603
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MCT06030C2700FP500 Details

  • Manufacturer Part Number:

    MCT06030C2700FP500

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Germany, Israel

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    12

  • Additional Feature:

    ANTI-SULFUR;RATED AC VOLTAGE:75V

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.55 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.85 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    CECC40401-801

  • Resistance:

    270 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    50 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    75 V

MCT06030C2700FP500 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the MCT06030C2700FP500 is a rectangular pad with a size of 6.1 mm x 3.1 mm, with a 0.5 mm radius corner and a 0.3 mm spacing between pads.
  • To handle thermal management, ensure good thermal conductivity between the device and the PCB by using a thermal pad or thermal interface material. Also, consider using a heat sink or a metal core PCB to dissipate heat efficiently.
  • The maximum operating temperature range for the MCT06030C2700FP500 is -55°C to +150°C, with a derating of power dissipation above 125°C.
  • Yes, the MCT06030C2700FP500 is designed to withstand high-vibration environments. However, it's essential to ensure proper PCB mounting and secure the device to prevent mechanical stress and damage.
  • The recommended soldering profile for the MCT06030C2700FP500 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Ensure that the soldering process is done in a nitrogen atmosphere to prevent oxidation.

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MCT06030C2700FP500 Overview

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