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MCT0603MD7502DP500 - Vishay

Description: Thin Film Resistors - SMD .15W 75Kohms .5% 0603 SMD 25ppm

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MCT0603MD7502DP500 - Vishay - PCB symbol
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PCB Footprints
MCT0603MD7502DP500 - Vishay PCB footprint - Resistor Chip - Resistor Chip - MCT0603
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MCT0603MD7502DP500 - Vishay - 3D model - Resistor Chip - MCT0603
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MCT0603MD7502DP500 Details

  • Manufacturer Part Number:

    MCT0603MD7502DP500

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Germany, Israel

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    14

  • Additional Feature:

    ANTI-SULFUR, RATED AC VOLTAGE (V): 75

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.55 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.85 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.11 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; CECC40401-801

  • Resistance:

    75000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    25 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.5%

  • Working Voltage:

    75 V

MCT0603MD7502DP500 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MCT0603MD7502DP500 is a rectangular pad with a size of 0.6 mm x 0.3 mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
  • While MCT0603MD7502DP500 is rated for operation up to 150°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum power rating at the operating temperature. Additionally, the soldering process and PCB material should be suitable for high-temperature applications.
  • To prevent damage, handle the MCT0603MD7502DP500 by the edges, avoid touching the component's surface, and use an anti-static wrist strap or mat. During PCB assembly, ensure that the component is properly aligned and seated on the PCB to prevent mechanical stress.
  • The recommended soldering profile for MCT0603MD7502DP500 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
  • While MCT0603MD7502DP500 is not hermetically sealed, it is designed to operate in a normal environment. However, it's essential to consider the moisture sensitivity level (MSL) of the component and follow proper handling and storage procedures to prevent moisture absorption.

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MCT0603MD7502DP500 Overview

Use the download button to access the MCT0603MD7502DP500 schematic symbol, PCB footprint, and 3D model.
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