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MCT6S - onsemi

Description: Choice of 3 current transfer ratios; Two isolated channels per package; VDE approved for IEC60747-5-2; Two packages fit into a 16 lead DIP socket; Underwriters Laboratory (U.L.) recognized File E90700

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MCT6S - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - 8-SMD_2021
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MCT6S - onsemi  - 3D model - Small Outline Packages - 8-SMD_2021
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MCT6S Details

  • Manufacturer Part Number:

    MCT6S

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PDIP-8 GW

  • Manufacturer Package Code:

    709AF

  • Country Of Origin:

    Thailand

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.5

  • Additional Feature:

    UL RECOGNIZED

  • Coll-Emtr Bkdn Voltage-Min:

    30 V

  • Configuration:

    SEPARATE, 2 CHANNELS

  • Current Transfer Ratio-Min:

    20%

  • Dark Current-Max:

    100 nA

  • Forward Current-Max:

    0.06 A

  • Forward Voltage-Max:

    1.5 V

  • Isolation Voltage-Max:

    5000 V

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    2

  • On-State Current-Max:

    0.03 A

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -55 °C

  • Optoelectronic Device Type:

    TRANSISTOR OUTPUT OPTOCOUPLER

  • Packing Method:

    TUBE

  • Power Dissipation-Max:

    0.15 W

  • Response Time-Max:

    0.000025 s

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

MCT6S Frequently Asked Questions (FAQs)

  • The MCT6S can operate from -40°C to 150°C, but the recommended operating temperature range is -40°C to 125°C for optimal performance and reliability.
  • The MCT6S requires a bias voltage of 5V to 15V, and the recommended bias current is 10mA to 20mA. Ensure the bias voltage is stable and noise-free to achieve optimal performance.
  • Use a multi-layer PCB with a solid ground plane to minimize noise and EMI. Ensure good thermal conductivity by using thermal vias and a heat sink if necessary. Keep the component away from heat sources and ensure good airflow.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins of the MCT6S. Ensure the ESD protection devices are rated for the maximum voltage and current of the application.
  • Store the MCT6S in a dry, cool place away from direct sunlight and moisture. Handle the component by the body, not the leads, to prevent damage. Use anti-static packaging and handling procedures to prevent ESD damage.

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