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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for MCU0805MC1009FP500
- Part Number MCU0805MC1009FP500
- Manufacturer Vishay
- Last Modified Date Apr 28, 2022 1:17 PM UTC
- Pinout / Pin List Click Here (Member Only)
MCU0805MC1009FP500 Details
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Manufacturer Part Number:
MCU0805MC1009FP500
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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Reach Compliance Code:
Compliant
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Country Of Origin:
Germany, Israel
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ECCN Code:
EAR99
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HTS Code:
8533.21.00.30
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Factory Lead Time:
10 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
12
MCU0805MC1009FP500 Frequently Asked Questions (FAQs)
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The recommended land pattern for MCU0805MC1009FP500 is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a solder mask clearance of 0.1 mm. It's essential to follow the recommended land pattern to ensure proper soldering and to prevent thermal issues.
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While the MCU0805MC1009FP500 is rated for operation up to 150°C, it's essential to consider the derating curves and thermal management in high-temperature applications. Ensure that the component is properly heat-sinked, and the operating temperature is within the specified range to prevent thermal runaway and ensure reliability.
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The MCU0805MC1009FP500 is an ESD-sensitive device. To prevent damage, handle the component with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure that the assembly process and storage conditions meet the ESD protection requirements.
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The recommended soldering profile for MCU0805MC1009FP500 is a peak temperature of 260°C, with a dwell time of 10-30 seconds. Ensure that the soldering process meets the IPC J-STD-020D standard to prevent thermal damage and ensure reliable connections.
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While the MCU0805MC1009FP500 is a robust component, it's essential to consider the mechanical stress and vibration in high-vibration or high-shock applications. Ensure that the component is properly secured, and the PCB design takes into account the mechanical stress and vibration to prevent mechanical failure.
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MCU0805MC1009FP500 Overview
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