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MCU0805MD1000DP500 - Vishay

Description: Res Thin Film 0805 100 Ohm 0.5% 0.125W(1/8W) ±25ppm/C Pad SMD Automotive T/R

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MCU0805MD1000DP500 - Vishay PCB footprint - Resistor Chip - Resistor Chip - 0805+-
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MCU0805MD1000DP500 - Vishay  - 3D model - Resistor Chip - 0805+-
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MCU0805MD1000DP500 Details

  • Manufacturer Part Number:

    MCU0805MD1000DP500

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Germany, Israel

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    14

  • Additional Feature:

    ANTI-SULFUR, RATED AC VOLTAGE (V): 150

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.52 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.14 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; CECC40401-801

  • Resistance:

    100 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    25 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.5%

  • Working Voltage:

    150 V

MCU0805MD1000DP500 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MCU0805MD1000DP500 is a rectangular pad with a size of 1.3 mm x 1.3 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and thermal management.
  • While the MCU0805MD1000DP500 is rated for operation up to 150°C, it's essential to consider the derating curves and thermal management in high-temperature applications. Ensure proper heat sinking and thermal design to prevent overheating and ensure reliability.
  • To prevent electrostatic discharge (ESD) damage, handle the MCU0805MD1000DP500 with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure that the assembly process and storage environment are ESD-controlled.
  • The recommended soldering profile for MCU0805MD1000DP500 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Ensure that the soldering process is within the specified temperature range to prevent damage.
  • While the MCU0805MD1000DP500 is a robust component, it's essential to consider the mechanical stress and vibration in high-vibration or high-shock applications. Ensure proper mounting, soldering, and mechanical design to prevent component failure.

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MCU0805MD1000DP500 Overview

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Part Image TNPW0805100RDEEC0H Vishay Intertechnologies

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Part Image M1208050D1000DP500 Vishay Intertechnologies

Fixed Resistor, Thin Film, 0.1W, 100ohm, 150V, 0.5% +/-Tol, 25ppm/Cel, Surface Mount, 0805

For a full list of alternate parts for MCU0805MD1000DP500, check out Findchips.com