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MCU0805MD2004BP500 - Vishay

Description: Thin Film Resistors - SMD .2W 2Mohms .1% '0805 25ppm AEC-Q200

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MCU0805MD2004BP500 - Vishay - PCB symbol
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PCB Footprints
MCU0805MD2004BP500 - Vishay PCB footprint - Resistor Chip - Resistor Chip - MCU0805-2022-1
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MCU0805MD2004BP500 - Vishay - 3D model - Resistor Chip - MCU0805-2022-1
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MCU0805MD2004BP500 Details

  • Manufacturer Part Number:

    MCU0805MD2004BP500

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    14

  • Additional Feature:

    ANTI-SULFUR, RATED AC VOLTAGE (V): 150

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.52 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.14 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; CECC40401-801

  • Resistance:

    2000000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    25 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.1%

  • Working Voltage:

    150 V

MCU0805MD2004BP500 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MCU0805MD2004BP500 is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
  • While the MCU0805MD2004BP500 is rated for operation up to 150°C, it's essential to consider the derating curves and thermal management in high-temperature applications. Ensure proper heat sinking and follow the recommended operating conditions to avoid overheating and potential damage.
  • To prevent electrostatic discharge (ESD) damage, handle the MCU0805MD2004BP500 with proper ESD protection measures, such as using an ESD wrist strap, mat, or workstation. Ensure that the device is stored in an ESD-safe environment and follow proper handling procedures during assembly and testing.
  • The recommended soldering profile for MCU0805MD2004BP500 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Ensure that the soldering process is within the specified temperature range to avoid damaging the component.
  • While the MCU0805MD2004BP500 is not specifically designed for humid environments, it can operate in environments with relative humidity up to 60%. However, it's essential to ensure proper sealing and conformal coating to prevent moisture ingress and corrosion.

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MCU0805MD2004BP500 Overview

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