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MCU0805MZ0000ZP500 - Vishay

Description: Thin Film Resistors - SMD ZERO OHM JUMPER

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MCU0805MZ0000ZP500 - Vishay - PCB symbol
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PCB Footprints
MCU0805MZ0000ZP500 - Vishay PCB footprint - Resistor Chip - Resistor Chip - MCU0805-1
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MCU0805MZ0000ZP500 - Vishay - 3D model - Resistor Chip - MCU0805-1
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MCU0805MZ0000ZP500 Details

  • Manufacturer Part Number:

    MCU0805MZ0000ZP500

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Germany, Israel

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    12

  • Additional Feature:

    ANTI-SULFUR, RATED CURRENT: 1.5A

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.52 mm

  • Package Length:

    2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.14 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; CECC40401-801

  • Resistor Type:

    JUMPER

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

MCU0805MZ0000ZP500 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MCU0805MZ0000ZP500 is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape.
  • To handle thermal considerations, ensure good thermal conduction by using a thermal pad on the PCB, and consider using thermal vias to dissipate heat. Also, ensure good airflow around the component.
  • The recommended soldering profile for the MCU0805MZ0000ZP500 is a peak temperature of 260°C, with a dwell time of 30-60 seconds above 217°C. A reflow soldering process is recommended.
  • To ensure reliability in high-vibration applications, use a secure mounting method, such as a screw or adhesive, and consider using a vibration-dampening material, such as a silicone adhesive, to reduce stress on the component.
  • The maximum operating temperature range for the MCU0805MZ0000ZP500 is -55°C to 150°C, with a storage temperature range of -55°C to 150°C.

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MCU0805MZ0000ZP500 Overview

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