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MCU80N06-TP - MCC

Description: N-Channel 60 V 80A (Tc) 85W Surface Mount DPAK

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MCU80N06-TP - MCC - PCB symbol
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PCB Footprints
MCU80N06-TP - MCC PCB footprint - Other - Other - MCU80N06-TP-3
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3D Models
MCU80N06-TP - MCC - 3D model - Other - MCU80N06-TP-3
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MCU80N06-TP Details

  • Manufacturer Part Number:

    MCU80N06-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DPAK-3/2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    290 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    80 A

  • Drain-source On Resistance-Max:

    0.013 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    80 pF

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    85 W

  • Pulsed Drain Current-Max (IDM):

    150 A

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

MCU80N06-TP Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for MCU80N06-TP is a standard SOT223 package with a minimum pad size of 1.5mm x 1.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • To ensure reliable operation of MCU80N06-TP in high-temperature environments, it is recommended to follow proper thermal management practices, such as providing adequate heat sinking, using a thermal interface material, and keeping the junction temperature below 150°C.
  • The maximum allowed voltage on the gate of MCU80N06-TP is 20V, but it is recommended to keep the gate voltage between 0V and 15V to ensure reliable operation and prevent damage to the device.
  • Yes, MCU80N06-TP can be used in switching applications, but it is recommended to follow proper switching frequency and duty cycle guidelines to prevent overheating and ensure reliable operation.
  • To protect MCU80N06-TP from electrostatic discharge (ESD), it is recommended to follow proper ESD handling procedures, such as using an ESD wrist strap, ESD mat, and ESD-safe packaging and storage.

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MCU80N06-TP Overview

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