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MCWR12X2201FTL - Multicomp Pro

Description: RES, 2K2, 1%, 0.25W, 1206, THICK FILM

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MCWR12X2201FTL - Multicomp Pro - PCB symbol
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PCB Footprints
MCWR12X2201FTL - Multicomp Pro PCB footprint - Resistor Chip - Resistor Chip - MCWR12X
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3D Models
MCWR12X2201FTL - Multicomp Pro - 3D model - Resistor Chip - MCWR12X
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MCWR12X2201FTL Details

  • Manufacturer Part Number:

    MCWR12X2201FTL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Unknown

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    SPC Multicomp

  • YTEOL:

    12

  • Additional Feature:

    LASER TRIMMABLE, RATED AC VOLTAGE (V): 200

  • Construction:

    Chip

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    3.1 mm

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Resistance:

    2200 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

MCWR12X2201FTL Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MCWR12X2201FTL is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and thermal management.
  • The MCWR12X2201FTL is rated for operation up to 150°C, but it's recommended to derate the power handling at higher temperatures. Consult the datasheet for specific derating curves and guidelines.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the pads. Use a reflow oven or a hot air gun to solder the component, and avoid applying excessive force or pressure during the process.
  • The typical ESL of the MCWR12X2201FTL is around 0.5nH to 1nH, which is relatively low due to its compact size and internal construction. This makes it suitable for high-frequency applications.
  • The MCWR12X2201FTL is designed to withstand moderate vibration levels, but it's recommended to follow proper mounting and soldering techniques to ensure reliability. Consult the datasheet for specific vibration testing results and guidelines.

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MCWR12X2201FTL Overview

Use the download button to access the MCWR12X2201FTL schematic symbol, PCB footprint, and 3D model.
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