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MCXA153VLH - NXP

Description: ARM Microcontrollers - MCU MCXA10, 64LQFP

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PCB Footprints
MCXA153VLH - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - SOT1699-1
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3D Models
MCXA153VLH - NXP  - 3D model - Quad Flat Packages - SOT1699-1
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MCXA153VLH Details

  • Manufacturer Part Number:

    MCXA153VLH

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-64

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    13

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    NO

  • CPU Family:

    CORTEX-M33

  • Clock Frequency-Max:

    50 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PQFP-G64

  • Length:

    10 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    4

  • Number of I/O Lines:

    52

  • Number of Serial I/Os:

    3

  • Number of Terminals:

    64

  • Number of Timers:

    8

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP64,.47SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    32768

  • ROM (words):

    131072

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    96 MHz

  • Supply Current-Max:

    100 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

MCXA153VLH Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a thermal pad on the bottom of the package, connected to a large copper area on the PCB. This helps to dissipate heat efficiently. Additionally, keeping the PCB traces and components away from the thermal pad can improve thermal performance.
  • To ensure reliable operation in high-temperature environments, it is essential to follow proper thermal design and layout guidelines. This includes using a heat sink, thermal interface material, and ensuring good airflow. Additionally, derating the device's power consumption and operating frequency can help to reduce the junction temperature and ensure reliable operation.
  • For EMI and RFI shielding, it is recommended to use a shielded enclosure or a metal can package. Additionally, using a common-mode choke and ferrite beads on the power supply lines can help to reduce EMI emissions. Proper PCB layout and routing, such as keeping sensitive signals away from the edges of the board, can also help to reduce EMI and RFI.
  • To troubleshoot issues with the device's internal oscillator, check the oscillator's frequency and amplitude using an oscilloscope. Verify that the oscillator is enabled and that the clock signal is properly routed to the device's clock input. Also, check for any noise or interference on the power supply lines that could be affecting the oscillator's operation.
  • For power sequencing and supply voltage ramp-up, it is essential to ensure that the power supply voltage ramps up slowly and monotonically to prevent damage to the device. A recommended power-up sequence is to first apply the analog power supply voltage, followed by the digital power supply voltage. The power supply voltage should be ramped up at a rate of 1-10 mV/μs to prevent damage to the device.

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MCXA153VLH Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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