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MCZ33800EK - NXP

Description: Motor / Motion / Ignition Controllers & Drivers AUTO ENG Control IC

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Symbol
MCZ33800EK - NXP - PCB symbol
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PCB Footprints
MCZ33800EK - NXP PCB footprint - Small Outline Packages - Small Outline Packages - SOIC
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3D Models
MCZ33800EK - NXP - 3D model - Small Outline Packages - SOIC
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MCZ33800EK Details

  • Manufacturer Part Number:

    MCZ33800EK

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    0.65 MM PITCH, ROHS COMPLIANT, SOIC-54

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    1

  • Additional Feature:

    ALSO REQUIRES A SUPPLY OF 5V TO 36V

  • Driver Number of Bits:

    8

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    R-PDSO-G54

  • JESD-609 Code:

    e3

  • Length:

    17.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    54

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP54,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.45 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7.5 mm

MCZ33800EK Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout guide in the MCZ33800EK application note (AN12241). It's essential to follow the guidelines for component placement, routing, and thermal management to ensure optimal performance, low EMI, and thermal dissipation.
  • The MCZ33800EK has multiple low-power modes. To configure the device for low-power mode, refer to the 'Power Management' section in the datasheet. You can use the PMU (Power Management Unit) to control the power modes. Additionally, you can use the 'Low Power Mode' bit in the 'System Control Register' to enable or disable low-power mode.
  • The MCZ33800EK has an operating temperature range of -40°C to 125°C. However, the device can be operated at a reduced frequency and voltage range for temperatures above 105°C. Refer to the 'Operating Conditions' section in the datasheet for more information.
  • The MCZ33800EK has a built-in watchdog timer (WDT) that can be enabled or disabled using the 'Watchdog Timer Control Register'. You can configure the WDT timeout period, reset mode, and other parameters using the 'Watchdog Timer Configuration Register'. Refer to the 'Watchdog Timer' section in the datasheet for more information.
  • NXP recommends using decoupling capacitors with a value of 10nF to 100nF, depending on the specific application and operating frequency. Place the decoupling capacitors as close as possible to the device's power pins to ensure optimal performance and noise reduction.

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MCZ33800EK Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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