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MDD1503RH - MagnaChip

Description: MagnaChip MDD1503RH N-channel MOSFET Transistor, 87.5 A, 30 V, 3-Pin DPAK

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MDD1503RH - MagnaChip PCB footprint - Other - Other - DPAK (TO-252)
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MDD1503RH Details

  • Manufacturer Part Number:

    MDD1503RH

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-252, DPAK-3/2

  • ECCN Code:

    EAR99

  • Manufacturer:

    MagnaChip Semiconductor Ltd

  • YTEOL:

    5.3

  • Avalanche Energy Rating (Eas):

    146 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    87.5 A

  • Drain-source On Resistance-Max:

    0.0047 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    221 pF

  • JEDEC-95 Code:

    TO-252AA

  • JESD-30 Code:

    R-PSSO-G2

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    59.5 W

  • Pulsed Drain Current-Max (IDM):

    350 A

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

MDD1503RH Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a 2-layer or 4-layer board with a thermal relief pattern on the top and bottom layers, and to place thermal vias under the device to dissipate heat effectively.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, use a suitable heat sink, and implement thermal management techniques such as thermal monitoring and shutdown.
  • The MDD1503RH has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing, and to use ESD protection devices such as TVS diodes or ESD arrays on the PCB.
  • While the MDD1503RH is designed to operate in a wide range of temperatures, it's not recommended for use in high-humidity environments without proper protection. Consider using conformal coating, potting, or hermetic sealing to protect the device from moisture.
  • The recommended storage condition for the MDD1503RH is in a dry, cool place with a temperature range of -40°C to 125°C and humidity below 60%. Avoid storing the device in direct sunlight or near heat sources.

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MDD1503RH Overview

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