MDM-9SBSP - ITT CANNON

MDM-9SBSP Details

• Manufacturer Part Number:

  MDM-9SBSP

• Part Life Cycle Code:

  Active

• ECCN Code:

  EAR99

• HTS Code:

  8536.69.40.30

• Factory Lead Time:

  16 Weeks

• Manufacturer:

  ITT Interconnect Solutions

• YTEOL:

  6

• Body Breadth:

  0.31 inch

• Body Depth:

  0.355 inch

• Body Length:

  1.39 inch

• Body/Shell Style:

  RECEPTACLE

• Connector Type:

  D MICROMINIATURE CONNECTOR

• Contact Finish Mating:

  GOLD

• Contact Finish Termination:

  Gold (Au)

• Contact Gender:

  FEMALE

• Contact Material:

  COPPER ALLOY

• Contact Pattern:

  STAGGERED

• Contact Resistance:

  8 mΩ

• Contact Style:

  RND PIN-SKT

• DIN Conformance:

  NO

• Dielectric Withstanding Voltage:

  900VAC V

• Empty Shell:

  NO

• Filter Feature:

  NO

• IEC Conformance:

  NO

• Insertion Force-Max:

  2.224 N

• Insulation Resistance:

  5000000000 Ω

• Insulator Material:

  DIALLYL PHTHALATE

• JESD-609 Code:

  e4

• MIL Conformance:

  NO

• Mating Contact Pitch:

  0.05 inch

• Mating Contact Row Spacing:

  0.043 inch

• Mating Information:

  MULTIPLE MATING PARTS AVAILABLE

• Mixed Contacts:

  NO

• Mounting Option 1:

  #2-56

• Mounting Option 2:

  JACKPOST

• Mounting Style:

  STRAIGHT

• Mounting Type:

  BOARD AND PANEL

• Number Of Connectors:

  ONE

• Number Of PCB Rows:

  2

• Number of Rows Loaded:

  2

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -55 °C

• Option:

  GENERAL PURPOSE

• PCB Contact Pattern:

  STAGGERED

• PCB Contact Row Spacing:

  2.54 mm

• Rated Current (Signal):

  3 A

• Shell Finish:

  YELLOW CHROMATE/CADMIUM

• Shell Material:

  ALUMINUM ALLOY

• Shell Size:

  A

• Terminal Length:

  0.109 inch

• Terminal Pitch:

  2.54 mm

• Termination Type:

  SOLDER

• Total Number of Contacts:

  9

• Withdrawl Force-Min:

  .139 N