MF-RX375 footprint, schematic symbol and 3D model by Bourns

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MF-RX375 Details

A symmetrical layout with a solid ground plane and minimal signal trace length is recommended. Keep the input and output traces separate and avoid crossing them to minimize crosstalk.
Use a thermally conductive material for the PCB and ensure good thermal contact between the device and the PCB. Also, consider using a thermal pad or heat sink to dissipate heat.
A 10nF to 100nF input capacitance and a 10nF to 100nF output capacitance are recommended to ensure stability and optimal performance.
Use a voltage regulator or a transient voltage suppressor (TVS) to protect the device from overvoltage. Add a current-limiting resistor or a fuse to prevent overcurrent.
A soldering profile with a peak temperature of 240°C to 250°C and a dwell time of 30 seconds to 60 seconds is recommended to prevent damage to the device.

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Use the download button to access the MF-RX375 schematic symbol, PCB footprint, and 3D model.

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