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MF4SAM3HN/9BA659Z - NXP

Description: Supports MIFARE Crypto1, DES, TDEA (112 bits and 168 bits), AES (128 bits, 192 bits and 256 bits), RSA (up to 2048 bits) and ECC (up to 256 bits) cryptography • Supported NXP products: – MIFARE DESFire EV3, EV2, EV1, and Light – MIFARE Plus EV2, EV1, X, S, and SE – MIFARE Classic EV1 – MIFARE Ultralight AES, C and EV1

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PCB Footprints
MF4SAM3HN/9BA659Z - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - SOT617-3...
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3D Models
MF4SAM3HN/9BA659Z - NXP  - 3D model - Quad Flat No-Lead - SOT617-3...
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MF4SAM3HN/9BA659Z Details

  • Manufacturer Part Number:

    MF4SAM3HN/9BA659Z

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HVQFN-32

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • Additional Feature:

    IT ALSO OPERATES AT 1.8V AND 3 V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PQCC-N32

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

  • uPs/uCs/Peripheral ICs Type:

    CRYPTOGRAPHIC AUTHENTICATOR

MF4SAM3HN/9BA659Z Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the MF4SAM3HN/9BA659Z is -40°C to 85°C, with a storage temperature range of -40°C to 150°C.
  • The NFC antenna tuning requires a careful selection of the antenna design, component values, and layout. NXP provides a dedicated antenna tuning guide and a calculator tool to help with the design process. Additionally, the datasheet provides guidelines for antenna design and component selection.
  • The maximum current consumption of the MF4SAM3HN/9BA659Z depends on the operating mode and frequency. According to the datasheet, the maximum current consumption is around 50 mA in active mode and 10 μA in sleep mode.
  • NXP provides a secure boot and firmware update mechanism through its Secure Firmware Update (SFU) feature. This feature uses cryptographic techniques to ensure the authenticity and integrity of the firmware. The implementation details can be found in the datasheet and the NXP documentation.
  • NXP provides a range of development tools and SDKs for the MF4SAM3HN/9BA659Z, including the NXP SDK for NFC, the NXP IDE, and the Keil µVision development environment. Additionally, third-party development tools and SDKs are available from companies like STMicroelectronics and IAR Systems.

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MF4SAM3HN/9BA659Z Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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