The recommended land pattern for the MFP-25BRD52-56K is a rectangular pad with a size of 1.3mm x 0.8mm, with a solder mask clearance of 0.1mm. It's recommended to follow the IPC-7351 standard for land pattern design.
The MFP-25BRD52-56K has a maximum operating temperature of 125°C, making it suitable for most industrial and automotive applications. However, it's not recommended for use in extreme high-temperature applications above 150°C.
Yes, the MFP-25BRD52-56K is compatible with lead-free soldering processes, including SAC305 and Sn96.5Ag3Cu0.5. However, it's recommended to follow the manufacturer's recommended soldering profile to ensure reliable assembly.
The MFP-25BRD52-56K has a typical power rating of 0.5W, making it suitable for most low-power applications. However, the actual power rating may vary depending on the specific application and operating conditions.
Yes, the MFP-25BRD52-56K is RoHS and REACH compliant, making it suitable for use in most global markets. However, it's recommended to verify the compliance status with the manufacturer or supplier.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
MFP-25BRD52-56K Overview
Use the download button to access the MFP-25BRD52-56K schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MFP-2,
or try a keyword search, such as Metal Film Resistors
