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MFR4310E1MAE40 - NXP

Description: FLEXRAY COMM CONTROLLER, AEC-Q100, LQFP; MCU Applications:Communication Controller; Architecture:Power Architecture; MCU Core Size:32bit; Program Memory Size:-; RAM Memory Size:-; CPU Speed:40MHz; No. of I/O s:23I/O s; MCU Case RoHS Compliant: Yes

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PCB Footprints
MFR4310E1MAE40 - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - 64 LQFP
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MFR4310E1MAE40 - NXP  - 3D model - Quad Flat Packages - 64 LQFP
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MFR4310E1MAE40 Details

  • Manufacturer Part Number:

    MFR4310E1MAE40

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    10 X 10 MM, 1.40 MM HEIGHT, 0.50 PITCH, LEAD FREE, MS-026BCD, LQFP-64

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Additional Feature:

    IT ALSO REQUIRES 3.3V I/O SUPPLY

  • Address Bus Width:

    16

  • Boundary Scan:

    NO

  • Clock Frequency-Max:

    40 MHz

  • Communication Protocol:

    MIL STD 1553A; MIL STD 1553B; MCAIR; STANAG-3838

  • Data Encoding/Decoding Method:

    NRZ

  • Data Transfer Rate-Max:

    1.25 MBps

  • External Data Bus Width:

    16

  • JESD-30 Code:

    S-PQFP-G64

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of Serial I/Os:

    2

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP64,.47SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    2.75 V

  • Supply Voltage-Min:

    2.25 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

MFR4310E1MAE40 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the RF traces as short as possible and use a 50-ohm impedance-controlled line to the antenna.
  • Implement a robust protocol with error correction, use a suitable modulation scheme, and ensure proper antenna design and placement. Also, consider implementing a mesh network topology for increased reliability.
  • Choose an antenna with a suitable radiation pattern, ensure proper impedance matching, and place the antenna at least 10 mm away from the PCB edge. Avoid placing the antenna near metal components or edges.
  • Use the device's built-in power-saving modes, optimize the transmission protocol, and consider using a low-power MCU. Also, ensure proper power supply decoupling and use a suitable voltage regulator.
  • Ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the thermal pads. Keep the device away from high-temperature components and ensure proper PCB thermal design.

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MFR4310E1MAE40 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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