MFRC63003HNY - NXP

MFRC63003HNY Details

• Manufacturer Part Number:

  MFRC63003HNY

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  HVQFN-32

• Country Of Origin:

  Mainland China, Taiwan

• HTS Code:

  8542.39.00.01

• Factory Lead Time:

  13 Weeks

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  8

• JESD-30 Code:

  S-PQCC-N32

• JESD-609 Code:

  e4

• Length:

  5 mm

• Moisture Sensitivity Level:

  2

• Number of Terminals:

  32

• Operating Temperature-Max:

  105 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  HVQCCN

• Package Equivalence Code:

  LCC32,.2SQ,20

• Package Shape:

  SQUARE

• Package Style:

  CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

• Peak Reflow Temperature (Cel):

  260

• Seated Height-Max:

  1 mm

• Supply Voltage-Max:

  5.5 V

• Supply Voltage-Min:

  2.5 V

• Supply Voltage-Nom:

  5 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Finish:

  Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

• Terminal Form:

  NO LEAD

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  QUAD

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  5 mm

• uPs/uCs/Peripheral ICs Type:

  CRYPTOGRAPHIC AUTHENTICATOR